Yeb Havinga (@YebHavinga)
"If I get disappointed, I get disappointed really hard - so I actually do this thing where I'll look at who I'm up against and decide, 'OK, I'm rooting for them instead'."
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Publication date: 28 February 2026
而EMIB-T则在硅桥中引入TSV通孔结构，使得信号可垂直穿越桥接芯片本体，实现更高密度、更短路径的垂直互连。
The opportunity is enormous right now precisely because it's so new. Early adopters are claiming top positions in AI responses while their competitors remain oblivious to this emerging channel. But this window won't stay open forever. As more people recognize the value of appearing in AI results, competition will increase and optimization will become more sophisticated. The time to understand and implement AIO strategies is now, while the landscape is still relatively uncrowded.